Thermal Material Bond-ply 100


300 in stock

SKU: bond-ply 100 Categories: , Tags: ,


This high quality double sided self adhesive thermal interface material is ideal for sticking circuits and other parts to heatsinks without the need for screws. It provides both electrical isolation and high thermal conductivity, which we used in our ZVS Power Resonator – CRO-SM1 with heatsinks.

Provided in 50 x 50mm sheets, this thermal interface material can easily be cut to size to meet your needs for cooling all sorts of devices such as CPUs, Transistors, and other electronics. The soft thermal material is 0.129mm thick which helps to fill gaps and allow good contact between uneven surfaces.




Thickness 0.129mm
Dimensions(mm) 50 x 50
Thermal Impedance 0.52°C-in2/W (@50 psi)
Thermal Conductivity 0.8W/m.k

Additional information

Weight 0.04 kg
Dimensions 100.00000000 × 100.00000000 × 0.45000000 mm


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